PCBManufacturingProcessDemystified（PCB盲孔底部裂痕原因分析）
1. Introduction to PCB Basics 1.1 Definition of Printed Circuit Board 1.2 Key Functions: Interconnection & Component Support 1.3 Common Terminology (IVH, PTH, Blind/Buried Vias)2. Core Production Stages 2.1 Substrate Preparation (Cutting & Edge Grinding) 2.2 Inner Layer Processing (Cleaning, Photoresist, Etching) 2.3 Layer Alignment & Lamination (Oxide Treatment, Pressing)3. Quality Control Procedures 3.1 AOI (Automated Optical Inspection) 3.2 VRS (Verification Repair Station) 3.3 Electrical Testing Methods4. Advanced Techniques & Materials 4.1 High-Density Interconnect (HDI) Technology 4.2 Specialty PCB Materials (Flex, High-Frequency) 4.3 Environmental Considerations in Manufacturing
